Siemens PLM and Hewlett Packard
3D printing for production
Together with Hewlett Packard (HP), Siemens PLM wants to advance 3D printing - from pure prototyping to a complete process for industrial production.
New additive manufacturing software from Siemens PLM 's NX portfolio is set to unlock the full potential of HP' s 3D printers. In combination with HP's 'Multi-Jet-Fusion' technology, the Siemens solution will enable control of the 'HP-Jet-Fusion' 3D printer - including material properties down to the voxel level (a voxel is a 3D pixel). According to Siemens PLM, thanks to multi-material support, different materials and colors can also be implemented in a printed component. This should enable designers and engineers to develop products that go far beyond today's production limits.
Chuck Grindstaff from Siemens PLM Software:
"Companies can develop more powerful products with lower weight and higher load limits. In addition, assemblies consisting of parts with different properties can be printed in one piece. This saves time and money while reducing manufacturing errors. These new possibilities will change the way parts are manufactured and, more importantly, open up completely new product ideas."
Control of the voxel level
According to Siemens PLM, designers and engineers can only take full advantage of additive manufacturing processes if they can control part and material properties - right down to the voxel level. This includes the ability to print parts with different structure, density, strength and friction as well as electrical and thermal properties. The control of voxel levels by the printer can thus have a significant impact on product innovation and manufacturing possibilities.
"Customers want to take full advantage of HP's new Multi Jet Fusion technology to control material and part properties at the voxel level. To do this, they need CAD/CAM/CAE systems that support such advanced design and simulation techniques," says Stephen Nigro, Head of 3D Printing at HP, explaining the collaboration with Siemens.
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