Martin Steger is the owner and managing director of iesy in Meinerzhagen. The company has been developing and manufacturing electronic products for over 55 years. Iesy is a specialist for individual embedded computing solutions. With a network of reliable partners and suppliers, the company helps to fulfill complex requirements with coordinated, modular applications. Iesy is actively involved in the development and definition of new standards.

Mr. Steger, what is the origin of the new standard - Open Standard Module (OSM)?

Martin Steger: In September 2019, we set up a working group in the Standardization Group for Embedded Technologies (SGeT) together with our partners Kontron and F&S Elektronik Systeme. The aim was to create a new embedded computer module standard - it should be a simple and cost-effective alternative to existing computer module standards. As chairman of the SDT.05 (Standardization Development Team) working group, I was able to incorporate the know-how and preliminary work of iesy's engineers into the new concept to a considerable extent. Our more than 55 years of experience in the electronics environment was a great advantage here.

Thanks to our good access to the embedded market and the daily exchange with the various market participants, we know the requirements and concerns of our customers very well. For example, the desire for highly efficient further processing of computer modules. Just one year later, the working group presented its results and defined the first freely accessible and universal standard for directly solderable and scalable embedded modules.

How do you see the launch of the OSM standard?

Steger : At embedded world 2020, the first manufacturers - including iesy - presented their concepts for future OSM developments. Our first modules are based on the "Size-0" and "Size-S" form factors. At the SPS 2021 trade fair in Nuremberg, we wanted to present these to the specialist audience for the first time together with a specially developed evaluation board. At embedded world 2022, we plan to offer the first production-ready modules and the aforementioned evaluation board for initial tests ready for use and delivery.

What advantages do you see in the solderable modules of the OSM series?

Steger : There are certainly factors such as small size, scalability and cost efficiency. In terms of size, the "Size-0" with just 15 mm x 30 mm is almost unique as a defined standard application. The largest module, the "Size-L", is also very compact for its performance class at 45 x 45 mm.

We can also process the modules automatically in the SMT assembly process. This has a very positive effect on the cost structure in production, testing and total cost of ownership (TCO). The use of expensive connectors is also a thing of the past with OSM. The OSM footprints create a very robust and power-dense connection to the baseboard, making OSM ideal for applications in unusual environments. Another advantage is the open source approach on which the standard is based. Data is provided by iesy via a Git repository that can be accessed directly by developers worldwide.

At embedded world next year, iesy plans to present its first OSM modules, including a first module in Size-S format.

© iesy

For which target group is OSM interesting?

With its broad performance spectrum, OSM covers all the requirements of an open embedded system in its maximum configuration. This makes it ideal for use in edge computing or IoT systems. The small Size-S solder modules already have digital and analog video interfaces, several Gbit LAN ports and a Camera Serial Interface (CSI). Up to 79 interfaces on 662 pins are available on modules with Size-L. Developers can look forward to 58 GPIOs, which are available for future expansions.

What is the current status of development at your company and when can we expect to see the first modules?

In addition to our Size-0 module with ESP32 microcontroller, we wanted to present our Size-S with the Rockchip CPU "PX30" at the SPS in Nuremberg. In addition, our evaluation board, on which developers will be able to extensively test OSM modules of all four sizes in the future. Series production will start in the 1st quarter of 2022.

Looking to the future - where do you see OSM in the embedded market in the long term?

I am certain that OSM will find its place in the market in the future - because it meets our customers' requirements in terms of flexibility, miniaturization and costs. The current situation of component shortages also illustrates these aspects. With its functions and interfaces, OSM covers a wide range of applications and is therefore suitable for numerous applications.

Thank you very much for the interview Mr. Steger.