In the ParsiFAl 4.0 research project, which is funded by the Federal Ministry of Education and Research, several cooperation partners are working on developing thin electronic systems with the support of the VDI/VDE-IT project management organization. The microelectronic sensor systems in thin films - the smart sensor system labels or S3 labels - offer a new approach to networking intelligent production systems for Industry 4.0 and enable decentralized monitoring and control in the production environment.

S3 labels are based on microcontrollers, sensors, thin displays and integrated communication interfaces, all of which are embedded in films. The data collected can be used to assess the condition of a component in order to carry out predictive maintenance on systems, for example. This can significantly reduce the maintenance costs of production systems. In the field of logistics and packaging, the transport route of critical goods can be reliably tracked.

Demonstrators from Festo and Bosch

In the specific application of the research project, an S3 label is to be attached to a Festo pneumatic drive like an adhesive strip. The sensor and user data is then sent wirelessly and securely to a corresponding controller. In this way, drive data such as position, dynamics and environmental parameters can be monitored simultaneously by several S3 labels in a system. The control system can be optimized downstream using self-learning systems. An energy harvesting system, which generates energy through the movement of the piston, is intended to supply the film system in conjunction with a thin-film battery.

The ParsiFAI 4.0 label used in packaging technology.

© Robert Bosch

The film system is to be used at Bosch as an "intelligent label" on packaging for sensitive transport goods. Thanks to the integrated MEMS sensor technology, damaging influences on sensitive goods such as impacts or temperature fluctuations can be monitored. Application instructions are also to be stored on the autonomously operating label, which can be read out wirelessly via corresponding interfaces in the system and via mobile end devices.

Project partners from industry and science

The individual technologies are being researched by the consortium partners:

• Bosch is contributing many years of experience in the field of MEMS sensor technology to the project and is developing a demonstrator for packaging technology for the company's "Packaging Technology" division.
• The Institute for Microelectronics Stuttgart (IMS CHIPS) is responsible for the development and realization of the back-thinning processes for the integrated circuit components (ICs, sensors, MEMS).
• The Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. has experience in the areas of system design and energy harvesting. Together with Infineon Technologies and its partner Stackforce, secure communication solutions are being developed for the demonstrators.
• Infineon Technologies is designing the implementation options for radio modules and their configurations.
• Micronas is supplying the chips for magnetic position measurement.
• Würth Elektronik is contributing to the final systemic implementation with its flex and embedding technology.
• The creation of qualification procedures and test procedures for error analysis as well as the final qualification of the systems with regard to their reliability takes place at RoodMicrotec.