Both institutes are closely networked, particularly through the aforementioned business area, and share infrastructure at the Dresden site. The pooling of expertise and the simplified structures result in synergies that strengthen the research field, ensure faster further development and thus benefit customers and partners.

The market for microdisplays in the areas of augmented reality (AR), virtual reality (VR) and mixed reality (MR), often referred to collectively as 'XR', is an important growth market for the future. A key to success in this sector and the technological basis for the near-to-eye visualization of information is the integration of OLED and μLED frontplane technologies into CMOS backplanes. With the aim of exploiting synergies in the area of infrastructure and pooling expertise, Fraunhofer IPMS and Fraunhofer FEP, in coordination with the Fraunhofer-Gesellschaft, have decided to integrate the Microdisplays & Sensors business unit of Fraunhofer FEP into Fraunhofer IPMS.

OLED microdisplay with a resolution of 1440 x 1080 pixels and the world's smallest pixels of 2.5 µm

© Fraunhofer FEP (Claudia Jacquemin)

The change allows the Fraunhofer FEP, as a process-oriented institute, to focus even more strongly on its expertise in electron beam and plasma technology. This will provide technological offerings for the growing demand for solutions for energy and sustainability as well as life science and environmental technologies for industry and society now and in the future.

"By integrating the 'Microdisplays & Sensors' business unit of Fraunhofer FEP into Fraunhofer IPMS, we are pooling expertise under one roof, ensuring the optimal use of our infrastructures and will have greater opportunities in the acquisition of projects within the Microelectronics Alliance in the future. The transfer is a good example of the strategic further development of a research field and the leveraging of synergies across institutes," says Prof. Holger Hanselka, President of the Fraunhofer-Gesellschaft. "We are thus strengthening the research field and enabling new technological capabilities for microdisplays through synergetic use of the existing microelectronics infrastructure. The already existing close networking of the institutes at the Dresden site ensures seamless and continuous further development in this field of work."

Prof. Harald Schenk, Institute Director of Fraunhofer IPMS, adds: "In the future, Fraunhofer IPMS will increase its involvement in this field and focus more intensively on the area of heterogeneous integration of various chiplet technologies in conjunction with CMOS microelectronics. This future-oriented technology also includes the integration of organic semiconductors, e.g. OLED, and novel emitter technologies, e.g. μLED, which opens up new avenues in micro/optoelectronics and microsystems technology."