TSN

Meinrad Happacher,

A common test plan for the industry profile

Avnu, CLPA, ODVA, OPCF and PI are cooperating to generate a standardized test plan for the emerging TSN profile IEC/IEEE 60802 for industrial automation. All the organizations will be able to test their products for conformity with the new profile.

© WEKA Trade Media

The Avnu Alliance, CC-Link Partner Association, ODVA, OPC Foundation and PROFIBUS & PROFINET International announced at Hannover Messe their collaboration to develop a single common conformance assessment for the IEEE/IEC 60802 Time Sensitive Networking (TSN) Profile for Industrial Automation standard. The test plan will be used as a baseline test by all participating organizations and will be made available to the broader industrial automation ecosystem. This collaboration is intended to contribute to end-user confidence that 60802-compliant devices from different manufacturers supporting different automation protocols will reliably coexist at the TSN level on shared networks, including with devices using TSN for non-automation applications.

At the heart of the collaboration is the jointly agreed and owned test plan for the industrial automation market.

The value of this formal collaboration also lies in the creation of a structure in which all these organizations can work together and exchange ideas towards the ultimate goal of interoperability and coexistence in open standard networks for all protocols without the need to create a separate, formal organization. To facilitate communication, the activities of this collaboration will henceforth be referred to as "TIACC" (TSN Industrial Automation Conformance Collaboration).

TIACC represents a commitment by these organizations to work together to create an interoperable ecosystem of devices from different manufacturers to meet the criteria of the IEC/IEEE 60802 standardized profile and enable end users to use these devices securely in open standard networks. The goal is to have a final version of the unified common test plan available very soon after the publication of the IEC/IEEE 60802 profile.

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