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ODVA Headquarters

TSN

A common test plan for the industry profile

Avnu, CLPA, ODVA, OPCF and PI are cooperating to generate a standardized test plan for the emerging TSN profile IEC/IEEE 60802 for industrial automation. All the organizations will be able to test their products for conformity with the new profile.

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Ethernet-APL

The standard is

Standardization work has been underway since 2015 and the intrinsically safe physical layer designed for 2-wire cables called Ethernet-APL is now available; the first products are ready for the market.

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ODVA

HART devices on Ethernet/IP

At the trade fair, the ODVA announced the publication of further developments to the Ethernet/IP specification. These show how devices based on the HART communication protocol can be integrated into an Ethernet/IP architecture.

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TSN plus OPC UA

The ODVA follows suit

The ODVA is now setting up an internal 'special interest group' to develop a new network stack. This stack is intended to harmonize a native OPC UA information model and security features with CIP profiles and services.

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Comment on TSN plus OPC UA

The shaper knot

The ODVA announced on 16 August that it is developing a new network stack that harmonizes a native OPC UA information model with the CIP profiles. What is the context of this announcement? What does this have to do with the shapers and the OPC Foundation?

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ODVA

CIP Security complements CIP Safety

CIP safety technology is now being joined by CIP security: the user organization ODVA is presenting an Ethernet/IP demonstration with CIP security for the first time at SPS IPC Drives. Visitors to the ODVA stand can see the integration of cybersecurity in Ethernet/IP installations.

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ODVA

CIP Security complements CIP Safety

The proven CIP Safety technology is now complemented by CIP Security: ODVA announced that the organization was debuting an EtherNet/IP demonstration with CIP Security in its exhibit at the SPS IPC Drives trade show.

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