Choosing the right heat sink
In order to equip a data center with high-speed modules for optical interfaces, AFCI was looking for a suitable solution for cooling the high-performance servers. Pin heat sinks were the solution.
Articles and background information on the topic
In order to equip a data center with high-speed modules for optical interfaces, AFCI was looking for a suitable solution for cooling the high-performance servers. Pin heat sinks were the solution.

Dr. René Umlauft has been Managing Director for International Sales at Rittal since June 1, 2019. Dr. Umlauft succeeds Hans Sondermann.

The stainless steel versions of the Blue e+ cooling unit series from Rittal have been specially developed for demanding environmental conditions, for example for applications where a high level of corrosion protection is required, such as in the food industry and the process industry.
Electronic components are becoming increasingly smaller and the size of components, systems and installations is decreasing. For modern control cabinets, this often means a rethink in planning, particularly with regard to cooling.
The computing power in embedded systems and industrial computers is constantly increasing - and with it the power loss. Effective thermal management is therefore required. A simulation helps to select the right heat sinks and housings.

With the Blue e+ series, Rittal is launching a generation of chillers onto the market that, according to the manufacturer, enables a major leap in energy efficiency.
To protect electrotechnical components in control and switch cabinets from excessive temperatures, the heat must be efficiently dissipated from the cabinet. Instead of an active air conditioning component, passive heat dissipation is often sufficient.
An EU regulation is intended to help reduce harmful emissions in the industrial sector by 2030. However, the requirement to replace fluorinated greenhouse gases and carry out leakage checks is putting cooling system manufacturers under pressure. Gas sensors can help.
In the age of digitalization, more and more electronic components are moving into the enclosure - which can become a problem in terms of heat development. Accordingly, the issue of air routing in the enclosure needs to be addressed 'intelligently' as early as the planning phase.
Increased CPU and graphics performance with reduced noise levels. Inonet meets this challenge with a completely new cooling concept - the thermal tunnel.