
COM-HPC designs simplified
Congatec introduces an ecosystem for the development of COM-HPC client and server module-based designs that is compliant with the PCI Industrial Computer Manufacturers Group (PICMG) COM-HPC Carrier Board Design Guide.
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Congatec introduces an ecosystem for the development of COM-HPC client and server module-based designs that is compliant with the PCI Industrial Computer Manufacturers Group (PICMG) COM-HPC Carrier Board Design Guide.

Congatec - provider of embedded and edge computer technology - is changing its management team. One of the aims of the new management team is to accelerate internationalization.
3 questions for ... Edge Computing experts
No one can avoid edge computing at the moment. What advantages does the technology bring to the manufacturing industry? What do users need to be aware of? We asked selected industry experts these questions, among others, and here are the answers.

Including Focus Edge & Cloud Control
"Open source is the key to the urgently needed innovation leap towards digitalization and decarbonization of the economy and society," says financial expert Thomas Rappold. Read about open source for Industry 4.0 and other topics in the new e-paper.
What hardware performance requirements need to be considered for edge computing? What role does security play and which areas need to be secured? Martin Danzer from Congatec provides the answers.
3D vision is a must, especially for guided robotics and automated guided vehicles (AGV). The new COM-HPC modules can offer a decisive performance boost in these fields of application and also drive the trend towards hardware consolidation in both areas.

Congatec expands the 'i.MX 8' ecosystem with a starter set for AI-accelerated embedded vision applications.
The demand for computing power at the edge is increasing enormously. However, critical infrastructures are often subject to harsh environmental conditions. Embedded and server technologies must therefore converge at the edge.
At embedded world 2021 DIGITAL, Congatec presented a starter set for COM-HPC, new low-power SMARC modules and a COM Express Compact module based on AMD Ryzen embedded processors.
Congatec launches the 3.5-inch carrier board conga-SMC1/SMARC-x86. The size-optimized 'Smarc' 2.1 carrier board is application-ready and can therefore be used immediately in small to medium-sized series.