Werth Measurement Technology
Raster Scanning for TGV Measurements
Werth Messtechnik is expanding its multisensor measurement concept to include the patented "Raster Scanning HD" mode for the optical measurement of workpieces in electronics and semiconductor manufacturing.
The process inspects glass plates with through-glass vias (TGV) and measures hole diameters ranging from 10 to 80 µm, as well as position, shape, and other geometric properties, with a reproducibility of 0.1 µm. Total images with up to 20,000 megapixels are analyzed, with more than 1,000 geometric features processed per second. Multisensor coordinate measuring machines from the VideoCheck HA and UA series are used, with a measurement uncertainty of up to Euni = (0.15 + L/2000) µm. In addition, the Werth Fiber Probe enables 3D measurement of bore geometry, and the Chromatic Focus Probe measures the flatness and thickness of glass plates. Applications include quality control of TGV structures as well as electronics and semiconductor manufacturing.
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