Siemens/Foxconn
Together towards the production of the future
Siemens and Hon Hai Technology Group (Foxconn), the world's largest electronics manufacturer, have signed a memorandum of understanding to drive digital transformation and sustainability in smart manufacturing platforms.
The collaboration focuses on global manufacturing processes in the areas of electronics
electronics, information and communication technology and electric
electric vehicles (EV). Siemens and Foxconn want to jointly build a scalable and seamless engineering and manufacturing ecosystem.
Content of the declaration of intent
The memorandum of understanding defines key areas of cooperation to increase the level of
increase the level of automation in Foxconn's plants. These
include Electronics Manufacturing Services (EMS) and Contract Design and
Design and Manufacturing Service (CDMS), Foxconn's business model for electric vehicles.
for electric vehicles. The companies will explore initiatives for the factory of the future by implementing Siemens' leading portfolio in factory automation and industrial software.
factory automation and industrial software portfolio, which includes building blocks such as digital twin technology and artificial intelligence (AI).
Siemens Xcelerator, with its range of software and solutions, is expected to
will play a central role in optimizing Foxconn's engineering and manufacturing processes to increase the company's efficiency and agility.
The collaboration aims to leverage Siemens' technical expertise to improve Foxconn's
to improve Foxconn's sustainability footprint and contribute to energy
contribute to energy savings and a lower CO2 footprint. The
partnership includes the introduction of transparent monitoring processes and the use of professional services and digital solutions to help both companies work towards a greener future of electronics manufacturing.
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