Communication & networking - The winners
3rd place - BE.services
The low-footprint OPC UA PubSub TSN Stack eTSN (enable TSN) developed by BE.services together with Offenburg University of Applied Sciences can be ported to various platforms and components in the TSN network. It can be used on Intel or TI platforms in C2C communication as well as on platforms with a TSN-compatible Ethernet interface, for example Intel (wireless) or Renesas, as bridges or as a device implementation. The corresponding software development kit can be implemented both with an operating system and on a bare-metal platform.
The solution is based on the following components: a resource-optimized Matrikon eFlex OPC UA stack, a proprietary IEEE 802.AS PTP stack to ensure hardware portability and independence, and a test suite environment to monitor latency, jitter and synchronization of the TSN network. The software development kit allows implementation on different platforms and supports the implementation of hardware-specific IEEE 802.1 standards. The OPC UA FX specifications for C2C are supported and specifications such as C2D are also taken into account after official release.