Bopla
Enclosure Series expanded
Bopla has expanded its “Alubos” and “Bolink” product lines: The Alubos line of aluminum profile enclosures has been expanded to include a new model. With the ABPH 1680 KWLvariant, a heat sink solution isnow available for the largest enclosure size.
Electronic components with higher power density thus benefit from improved heat dissipation. At the same time, the base unit has been equipped with integrated wall brackets. This design has proven itself in smaller versions and takes typical operating conditions into account, since devices of this size are often wall-mounted.
The Bolink product line is expanding its range upward with two new base sizes, thereby offering more space for electronics and interfaces. The enclosures, available in white or black, integrate seamlessly into the existing series, which now comprises a total of three basic sizes in various variants. The new sizes are also available with optional integrally molded wall brackets. With dimensions of 76.25 mm × 76,26 mm × 29 mm and 86.25 mm × 56.25 mm × 29 mm, they are designed for compact applications that require additional volume.
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