Motek/Bondexpo 2023 trade fair duo
Motek with three main topics
The trade fair duo Motek and Bondexpo kicks off in Stuttgart on October 10. The organizer wants to offer exhibitors and visitors a platform for four days to discuss the current challenges facing the industry and how to solve them.
International crises, climate change, the energy transition, rising costs and the shortage of skilled workers are presenting companies with ever greater challenges. The trade fair duo Motek / Bondexpo is intended to show solutions to overcome these challenges, according to the organizer Schall Messen.
Exhibitors' priority topics include the entry into automation. With the use of digital technologies, automation technology forms the basis for energy-efficient and resource-saving processes. Based on this, Motek is divided into three main themes:
- smart and networked products for feeding, handling and assembly, for example grippers, handling systems, intelligent screwdriving technology, smart linear technology, smart drives and feeding components;
- Assembly assistance systems for manual and semi-automatic workstations, assisted picking, ergonomic and age-appropriate workstations, automated bin-picking, co-working with cobots and automated parts provision and parts removal;
- Solutions for easy implementation and commissioning, including software, plug-and-play solutions, starter kits and simulations using the digital twin.
Bondexpo showcases bonding technology as a key technology
The Bondexpo trade fair showcases solutions for all aspects of bonding technology. Joining technology connects almost all material combinations. Bonding technology can be used to integrate additional functions such as thermal conductivity or protection against water, dust and vibrations, which increases product service life. According to the trade fair organizer, adhesive bonding technology enables both lightweight construction and miniaturization, each of which contributes to energy and resource efficiency.
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