Embedded systemsNew products at embedded world 2017
In mid-March, the Nuremberg exhibition halls made room for everything to do with embedded systems technology. Computer&AUTOMATION presents a selection of new products that were on show at the embedded world 2017 stands.
Congatec is expanding its COM Express Basic portfolio with the new conga-TS175 Computer-on-Modules. These are available with two Intel Xeon processors and hyperthreading as well as 5 different Intel Core i7, i5 and i3 processors in a TDP range from 45 to 25 W. Bandwidth-intensive applications can rely on up to 32 GB of fast dual-channel DDR4-2400 memory - optionally with ECC support. The server-on modules offer all typical I/Os of the type 6 pinout. According to the manufacturer, expansion options including Intel Optane memory can be connected via numerous PCI Express Graphics Gen 3.0 lanes. 4x SATA 3.0 including RAID 0/1 support is available for conventional storage media. Other I/Os include 1x Gigabit Ethernet with Intel AMT support, 4x USB 3.0, 8x USB 2.0, HDA, 4x GPIO, LPC, SPI, I2C bus and 2x UART. The modules support the 64-bit versions of Windows 10 and Windows 10 IoT as well as the common Linux operating systems. Target markets include big data processing embedded cloud, edge and fog servers as well as systems for medical image processing, video surveillance and imaging quality control.