Las VegasNews from the CES 2017
The CES is one of the largest trade fairs for consumer electronics and always provides interesting impetus for the industry. This year, too, companies presented numerous innovations - especially in the area of the connected vehicle of the future.
... the latest smartphone from ASUS for augmented reality (AR) features the REAL3 image sensor chip from Infineon. The ASUSZenfone AR is currently the world's thinnest smartphone equipped with a 3D time-of-flight (ToF) camera for real-time spatial imaging of the environment. The image sensor chip measures the amount of time - the time-of-flight - that an infrared light signal takes to travel from the camera to the object and back again. Compared to other 3D imaging methods, this principle is said to offer important advantages in terms of spatial resolution, robustness, size and power consumption of battery-powered mobile devices. What can be achieved with networking ...