Congatec
Robust AI Performance at Temperatures from -40 °C to +85 °C
Congatec is expanding its portfolio of Computer-on-Modules (COMs) to include variants with Intel Core Ultra Series 3 processors for the industrial temperature range from -40 °C to +85 °C.
The modules deliver up to 180 TOPS of embedded computing performance and combine up to 16 CPU cores with up to 10 TOPS as well as an integrated NPU5 for low-power AI inference up to 50 TOPS. Four Xe3 cores enable additional GPGPU-based AI performance.
The COMs are available in COM-HPC Mini (conga-HPC/mPTL), COM-HPC Client (conga-HPC/cPTL), COM Express Type 10 Upgrade (conga-MC1000), COM Express compact (conga-TC1000) and ruggedized screw module (conga-TC1000r) form factors. They support PCIe Gen 5, USB 4 and offer high I/O bandwidth for data-intensive applications. As application-ready aReady.COMs, they are preconfigured with Windows 11, Windows 11 IoT Enterprise, ctrlX OS, Ubuntu Pro, KontronOS, Linux or Yocto. Optionally, aReady.VT enables the virtualization of multiple workloads on one module. IIoT connections are implemented via aReady.IOT and conga-connect, including cloud integration, remote maintenance and management.
Robustness options include conformal coating, specialized component selection and burn-in testing. The accompanying ecosystem offers evaluation carrier boards, cooling solutions, comprehensive documentation, design-in services and signal integrity measurements. The modules are suitable for industrial automation, robotics, medical, smart city, energy systems and safety-critical applications.
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