Fujitsu develops superconducting quantum computer

The superconducting quantum computer will operate with 250 logical qubits and will be based on Fujitsu's'STAR architecture', which was developed specifically for early-stage fault-tolerant quantum computing (Early-FTQC). Fujitsu aims to make quantum computing practical, particularly in fields such as materials science where complex simulations enable breakthrough discoveries. To this end, the company will continue to focus on advancing key scaling technologies in various areas of the quantum computing stack.

As part of this effort, Fujitsu has been selected as an implementation partner for the 'Research and Development Project for Improving Information and Communication System Infrastructures after 5G', which was publicly announced by the New Energy and Industrial Technology Development Organization (NEDO). Fujitsu will contribute to the project 'Advancing the development of quantum computers towards industrialization'. This project is being carried out in collaboration with the National Institute of Advanced Industrial Science and Technology (AIST) and RIKEN and will run until fiscal 2027.

The company wants to drive forward the development of practical quantum computing solutions suitable for industrial use. Following the construction of the 10,000-qubit machine, the company intends to launch further research initiatives from the 2030 financial year to advance superconducting qubits with diamond-based spin qubits. The long-term goal is to develop a machine with 1,000 logical qubits in the 2035 financial year - taking into account the possibility of networking several quantum chips with one another.

Focal points of technology development

Fujitsu's research is focused on the development of the following scaling technologies:

• High-throughput, high-precision qubit manufacturing technology: Improving the manufacturing precision of Josephson junctions, critical components of superconducting qubits that minimize frequency fluctuations.
• Chip-to-chip interconnect technology: Developing wiring and packaging technologies that enable the interconnection of multiple qubit chips, facilitating the manufacture of larger quantum processors.
• High-density packaging and low-cost qubit control: Addressing the challenges associated with cryo-cooling and control systems, including the development of techniques to reduce component count and heat dissipation.
• Decoding technology for quantum error correction: developing algorithms and system designs to decode measurement data and correct errors in quantum computations.