Articles and background information on the topic
Machine vision provider Stemmer Imaging has announced its figures for the 2018/2019 financial year and, according to CEO Arne Dehn, can look back on a successful performance overall in the reporting period.
read more...How can robots be made to grip bulk material components more easily in production? Vibration and image processing are the keys.
read more...Aluminum trays are ubiquitous as containers for food - for meals on planes, for transporting food ordered by phone or for pre-cooked ready meals from the supermarket. How can their quality be tested economically during production?
read more...The Dutch TKH Group has acquired 100% of the industrial camera manufacturer SVS-Vistek, based in Seefeld, southwest of Munich. TKH already owns the image processing companies Allied Vision, Chromasens, LMI Technologies, Mikrotron, NET and Tattile.
read more...Machine vision / image processing
A common "language" such as OPC UA is required to enable machines to communicate with each other. The specialist department for industrial image processing (Machine Vision) within the VDMA has approved a corresponding OPC UA Companion Specification.
read more...According to the organizers, 'Embedded Vision Europe' is the only conference in Europe that focuses exclusively on embedded vision technology. It will take place for the second time from October 24 to 25, 2019.
read more...According to the manufacturer Flir, the MWIR camera A6750 is suitable for recording fast thermal events thanks to its short exposure times and high frame rates.
read more...Isra Vision, a provider of surface inspection solutions for web materials and 3D machine vision applications, has acquired the Swiss company Photonfocus. The company is thus expanding its strategic portfolio in the field of embedded sensor technology.
read more...Silicon Software and Basler announce a change in the management of the subsidiary.
read more...Fraunhofer IOSB has developed an inline-capable 3D sensor based on the chromatic confocal principle for microscopic measurement of the topography of surfaces.
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