zuruck zur Themenseite

Articles and background information on the topic

Wire Harness Manufacturing

Andrea Gillhuber,

New OPC UA Companion Specification published

The OPC UA Companion Specification for wire harness manufacturing (OPC 40570) has been officially published. The standard is the result of a joint initiative by the VDMA Productronic and Machine Information Interoperability departments in collaboration with the OPC Foundation. The project was supported by the government-funded ARENA2036-VWS4LS project, among others.

© OPC Foundation

The aim of the new specification is to standardize digital communication between machines and manufacturing systems in wire harness production. This should improve interoperability, make processes more efficient and increase overall effectiveness in production.

The OPC 40570 specification is based on the existing OPC UA for Machinery standard (OPC 40001) and also integrates elements from the ISA 95 standard for job control (OPC 10031-4) and the OPC Foundation's basic device standard (OPC 10000-100). Among other things, it includes functions for machine identification, status monitoring and job management.

The first version of the standard focuses on processes in the cutting room, including cutting, stripping, crimping and sealing. An extension to other areas of wire harness production is already being planned.

In addition to wire harness manufacturers, the software provider DiIT and the machine manufacturers Komax and Schleuniger were also involved in the development. The prostep ivip group VES-WF supported the standardization process by providing data models.

Advertisement

The new specification is intended to enable a further step towards networked and future-proof production in the wire harness industry.

  • Xing Icon
  • LinkedIn Icon
Advertisement
Back to topic page
Advertisement

You might also be interested in

Advertisement
Advertisement
Advertisement
Advertisement
Advertisement
Advertisement
Advertisement

BE.services

The TSN Stack in Miniature Form

A seamless network using OPC UA PubSub and TSN all the way down to simple field-level sensors—can a streamlined TSN stack help make this vision a reality? BE.services is putting it to the test. Product Manager Melvin Francis explains the plans.  

read more...

Pepperl+Fuchs

Uncomplicated into the IIoT

A highlight exhibit at the Pepperl+Fuchs booth is a joint project with Bosch Digital Twins Industries and Syntax. Matthias Wieland from Bosch Digital Twin Industries and Hans-Günter Busch from Pepperl+Fuchs reveal the details of the predictive...

read more...
Subscribe to our newsletter
Advertisement
Back to home