Teledyne Dalsa
16k TDI line scan camera with a 1-Mhz line rate
Teledyne Dalsa introduces the TDI line scan camera family 'Linea HS2'. The camera series was developed for ultra-high-speed image processing under low-light conditions and delivers a resolution of 16k/5 µm and a maximum line rate of 1 MHz or a data throughput of 16 gigapixels per second.
The Teledyne Dalsa camera features a highly sensitive, backside-illuminated (BSI) multi-array TDI CMOS sensor with 16k/5 µm resolution and optimized quantum efficiency. The multi-array TDI sensor architecture allows the camera to be configured with maximized line rate, dynamic range or full frame, depending on the specific application requirements. This makes it particularly suitable for the inspection of semiconductor wafers, high-density interconnects and flat panel displays as well as for life science applications. On-chip binning also enables higher web speeds to increase system throughput. The camera is equipped with two Camera Link HS CX4 connectors for active optical cables, ensuring complete immunity to electromagnetic interference.
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